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Articles tagged with: Infineon Technologies and Infineon
Infineon Supplying EDGE Platfom to Nokia
Infineon Technologies has announced a deal to supply its XMM 2130 EDGE platform to Nokia for its low to mid range handsets. more
Related Tags: edge, nokia, , memory
Infineon and Huawei Sign Letter of Intent for Purchase of Communication ICs
Infineon Technologies says that it has signed a letter of intent for framework purchase agreement amounting US$68 millionwith Huawei Technologies to supply end-to-end chip solutions to Huawei's wireline and wireless communication systems. more
Related Tags: semiconductor, edge, huawei, iden, China
First MIFARE Compatible SIM-Based Solution for Mobile NFC Services
Gemalto, NXP and Infineon have announced they are demonstrating the first mobile contactless solution compliant with the Single Wire Protocol (SWP) standard and compatible with MIFARE infrastructures. NXP's MIFARE contactless technology is widely deployed for transport networks and access management worldwide. Being compatible with MIFARE, in addition to all the ISO 14443 contactless infrastructures, the solution will enable users to benefit from any contactless service on his/her mobile phone. more
Related Tags: gemalto, sim, semiconductor, nfc, nxp
Infineon Ships 100 Million Chips for Low-Cost Mobile Phones
Infineon Technologies says that it has shipped its 100 millionth low-cost mobile phone chipsets. The X-GOLD101 (E-GOLDvoice) mobile communications chip is the second generation of Infineon's integrated baseband chips for GSM/GPRS. more
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Worldwide Semiconductor Revenue Declined $12 Billion in 2008
For only the fifth time in the last 25 years, the semiconductor industry will post a decline in revenue, with worldwide semiconductor revenue totaling $261.9 billion in 2008, a 4.4 percent decline from 2007, according to preliminary results by Gartner. more
Related Tags: iphone, semiconductor, intel, flash-memory, samsung, apple, apple, qualcomm, cdma, gartner, toshiba, memory, hynix, nand, andrew, flash, dram
Developing SIM Cards with a 128MB Memory
Infineon Technologies and Micron Technology have announced a joint-venture to develop high-density subscriber identity module (HD-SIM) cards with a capacity greater than 128MB. more
Related Tags: sim-card, intel, flash-memory, mobile-banking, memory, micron-technology, nand, flash
Blame the 3G iPhone, Not the Carrier
SAN FRANCISCO -(Dow Jones)- Connectivity issues with Apple's popular iPhone 3G likely stem from the device, not the wireless carriers that support it, a problem that blemishes a product that has won rave reviews since it made its debut two months ago. more
Related Tags: deutsche-telekom, iphone, semiconductor, cisco, apple, apple, ipod, wind, verizon-wireless, verizon, chief-technology-officer, text-messages, ben
Apple Stresses Manufacturing Cost Reduction for iPhone 3G
The new iPhone 3G sports an evolutionary design that favors cost reduction instead of cutting-edge features, supporting AppleÃ's goal of expanding its market share and achieving a worldwide presence for the product, according to a physical teardown analysis conducted this weekend by iSuppli. more
Related Tags: semiconductor, flash-memory, samsung, wcdma, bluetooth, isuppli, gps, toshiba, apple, edge, battery, memory, samsung-electronics, iphone-3gs, wlan, nand, andrew, flash, dram
Infineon Damps Merger and Acquisition Speculation
FRANKFURT -(Dow Jones)- German semiconductor maker Infineon Technologies, Tuesday damped speculation that it could be part of merger and acquisition activity in the sector any time soon. more
Related Tags: broadcom, semiconductor, texas-instruments, qualcomm, gartner, texas, stmicroelectronics, credit-suisse, nxp, freescale-semiconductor, freescale
Infineon Introduces World's Smallest 3G Handset Platforms
Infineon Technologies has announced the availability of its new generation 3G platform family, which reduces the number of devices in the chipset from three to two and the component count of a typical platform by 50 per cent. The solutions are based on new members of the X-GOLD 61x-series and InfineonÃ's 3G Radio Frequency (RF) transceiver device, the SMARTi UE. more
Related Tags: hsupa, hsdpa, modem, chipset