The wireless chipset sector has grown significantly due to huge global demand for ubiquitous connectivity. Advances in next generation wireless technologies such as WiMAX and 3G, along with mobile TV, are driving the growth of multimode wireless chipsets offering many standards in a single solution. Moreover, there is an increasing use of reconfigurable processors for wireless chipsets due to the requirement to support many standards and technologies efficiently on a single product offering.
New analysis from Frost & Sullivan finds that the increased availability and lowering cost of portable devices such as mobile phones, laptops and other handheld devices are creating a vast market for wireless chipsets. The availability of high-speed wireless communication technologies on silicon is helping innovative companies find new application areas.
The various wireless technologies available differ on their coverage and data rate capabilities, leading to disconnects for users on the move between locations. Multimode devices capable of overcoming such service limitations are the first step in ensuing seamless mobility.
High-speed communications technologies offer high data rates usually with a lower coverage area when compared to their slower counterparts. 3G technologies provide variable data rates by varying the modulation techniques according to the distance of the user from the base station.
"The need to ensure connectivity to mobile users and a growing user base dictate that devices support at least two or more technologies with a mix that will ensure maximum coverage," remarks Technical Insights Research Analyst Zachariah Thomas.
Consumers tend to think big when they evaluate devices such as mobile phones and other portable devices. They want their phone to do more than just enable voice and rudimentary data communication. The arrival of high-speed Internet through 3G networks has led to a spurt in high-end applications and interfaces. This puts pressure on chip designers to come up with solutions that pack more features in a low-power, low-cost and low-real estate design.
Hence, the demand for maximum features at a minimum cost has become the biggest challenge for vendors that wish to remain competitive in this fierce market.
"Product differentiation is becoming harder in the wireless chipset segment partially because of the approach to design solutions from a standards-based approach and also to maintain interoperability in the various technology ecosystems," explains Thomas. "A 'big picture' strategy that looks at the whole product cycle including the phase after leaving the company's purview will go a long way in ensuring long-term competitiveness."
Finding a tradeoff between increased feature integration and power consumption will determine the success of participants manufacturing wireless chipsets for high-speed communications.
Posted to the site on 30th October 2007
Posted to: www.cellular-news.com/story/27049.php