3D Graphics Developer Joins OMAP Network

Superscape has joined Texas Instrument's OMAP Developer Network. Its Swerve 3D enabling technology is now available for TI's OMAP processors, on popular mobile operating systems such as Symbian OS for Series 60 devices.

"We are delighted to offer our customers Superscape's Swerve 3D technology on our OMAP processors," said Paul Werp, worldwide director of marketing for TI's OMAP platform. "Applications developed using Swerve 3D highlight the possibilities for 3D on mobile devices and showcase the real-time, multimedia processing capabilities of the OMAP platform."

Kevin Roberts, CEO, Superscape plc said: "Our new collaboration with TI on its widely adopted OMAP platform enables the global reach of our Swerve 3D enabling technology. Wireless users will benefit from exciting 3D graphics provided by the Swerve 3D engine on TI's powerful and power efficient OMAP processors."

Superscape's Swerve 3D is a generic solution that enables the delivery of a wide range of application genre including user interfaces and innovative messaging systems, as well as games. Small files sizes for fast download on GPRS network combine with high quality graphics to deliver innovative and exciting user experiences."

Posted to the site on 13th March 2003