SK Hynix Launches Low-Power Consumption DRAM Chips

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­SK Hynix has introduced DDR3L-RS (Reduced Standby) DRAM for mobile solutions, which it says significantly reduces the standby power consumption of devices.

By using 20nm class technology and efficiently managing standby current, this DDR3L-RS product reduces 70% of standby power compared to existing DDR3L DRAM. The chip works at 1.35V, while DDR3 DRAM does at 1.5V.

This product is available in both chip and module types. Chips for on-board use enable thinner devices to implement various densities with 2Gb(gigabit), 4Gb and 8Gb. SO-DIMMs (Small Outline Dual Inline Memory Module) are also provided with densities of 2GB(gigabyte), 4GB and 8GB.

"With the release of the new DDR3L-RS DRAM, we are now able to provide price competitive and low power products to the customers and these products will open a new area of memory semiconductor as one of the best memory solutions for the low to mid-end market," said Mr. Ji Bum Kim, Head of Worldwide Marketing & Sales Division of SK Hynix.

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