Qualcomm Now Sampling Dual-carrier HSPA+ and Multi-Mode 3G/LTE Chipsets

Published on: 1st Jan 1970: 1:33am

Qualcomm has announced that it is sampling the industry's first chipsets for dual-carrier HSPA+ and multi-mode 3G/LTE. The MDM8220 is the first chipset to support Dual-carrier High-Speed Packet Access Plus (DC-HSPA+); and the MDM9200 and the MDM9600 chipsets are the industry's first multi-mode 3G/LTE solutions.

Interoperability testing with infrastructure partners is already underway with multiple field trials scheduled for the first half of next year. Commercial launches of data-centric devices based on Qualcomm's MDM solutions are expected to begin during the second half of 2010.

"Qualcomm leads the industry in enabling next-generation mobile experiences with highly integrated, powerful and elegant solutions for dual-carrier HSPA+ and LTE. We are pleased to be working with so many industry leaders to bring these advanced technologies to market," said Alex Katouzian, vice president of product management, Qualcomm CDMA Technologies. "We remain committed to CDMA and OFDMA WAN modem leadership and the seamless and cost-effective commercialization of next-generation technologies around the world."

Among multiple network operators evaluating the new technologies are Japan's eMobile and Australia's Telstra Wireless. Qualcomm is also working with multiple infrastructure vendors, such as Huawei and Nokia Siemens Networks, to perform interoperability tests for dual-carrier HSPA+ and LTE. Among the many device manufacturers currently evaluating the new chipsets are Huawei, LG Electronics, Novatel Wireless, Sierra Wireless and ZTE.

Qualcomm's MDM8220 dual-carrier HSPA+ solution, based on the 3GPP Release 8 standard, provides peak downlink data rates of up to 42Mbps and 11 Mbps on the uplink, allowing carriers to easily upgrade their existing infrastructure equipment to achieve significantly higher bandwidths. Its dual-carrier technology doubles networks' bandwidth from 5 MHz to 10 MHz by aggregating two HSPA+ carriers in parallel.

The MDM9200 and the MDM9600 chipsets are the industry's first multi-mode 3G/LTE solutions that allow UMTS and CDMA2000 operators to upgrade to LTE while preserving backward compatibility to their existing 3G networks.

 

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