Infineon and Huawei Sign Letter of Intent for Purchase of Communication ICs

Infineon Technologies says that it has signed a letter of intent for framework purchase agreement amounting US$68 millionwith Huawei Technologies to supply end-to-end chip solutions to Huawei's wireline and wireless communication systems.

Infineon will provide semiconductor solutions for Huawei in the area of Central Office solutions (CO), Customer Premise Equipment (CPE) and Mobile Phone Platforms.

Shipment of the first products has already started.

"We feel very much honored to sign this agreement with Huawei", said Dominik Bilo, Senior Vice President, Sales, Marketing and Distribution of Infineon Technologies at the signing ceremony in Frankfurt, Germany. "Huawei and Infineon are maintaining a very positive and long lasting business relationship. We are very happy that we could extend this successful relationship from year to year and now sign this agreement for delivering cutting-edge technologies and communication solutions."

Posted to the site on 19th March 2009