Qualcomm Doubles Computing Power of Snapdragon With New Dual-CPU, Single-Chip Solution

Published on: 13th November 2008

Qualcomm has announced a new dual-CPU Snapdragon single-chip solution that extends the reach of the Snapdragon platform by targeting more advanced mobile computing devices. The QSD8672 chip features two computing cores capable of up to 1.5GHz for greater processing capabilities, in addition to optimized battery life and a full range of 3G mobile broadband and peripheral connectivity capabilities found on all Snapdragon chipsets.

Sampling is scheduled for the second half of 2009.

"This new dual-CPU Snapdragon chip demonstrates our long-term commitment to helping our customers develop a wide variety of innovative, data-centric, mobile computing devices," said Luis Pineda, senior vice president of marketing and product management for Qualcomm CDMA Technologies. "With its exceptional computing power and improved energy efficiency, the QSD8672 chip allows us to enable more advanced devices that are essentially always on, always awake and always connected."

Having two processing cores allows the chip to deliver an enhanced computing experience with more instantaneous response and greater ability to run multiple applications concurrently. The QSD8672 also will provide these devices with greater functionality, particularly 3G wireless broadband through the Company's integrated multi-mode modems including HSPA+ for up to 28 Mbps on the downlink and up to 11 Mbps on the uplink. The chip integrates GPS, Bluetooth, 1080p high-definition video recording and playback and also supports Wi-Fi and mobile TV technologies such as MediaFLO, DVB-H and ISDB-T. The integrated 2D and 3D graphics engines deliver device manufacturers the ability to offer products with display resolutions up to WSXGA (1440 x 900).

Mobile computing devices running on the dual-CPU Snapdragon solution can offer displays from 9 to 12 inches in size with a form-factor that is smaller, thinner, lighter and quieter than laptops currently on the market. These devices also take advantage of integrated 3G connectivity and comprehensive peripheral connectivity capabilities, which complement and enable these portable form-factors.

 

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