Developing SIM Cards with a 128MB Memory

Infineon Technologies and Micron Technology have announced a joint-venture to develop high-density subscriber identity module (HD-SIM) cards with a capacity greater than 128MB.

HD-SIMs combine high density with improved security functionality which the firms say enables operators to offer graphically-rich, value-added services such as mobile banking and contactless mobile ticketing. Further, operators can securely update or delete applications through their wireless network while new applications, services and settings can be downloaded or pushed to the HD-SIM at any time.

Working in close technical collaboration, both companies are leveraging their respective expertise to architect modular chip solutions that combine an Infineon security microcontroller with MicronÃ's NAND flash memory with features designed specifically for HD-SIM applications. Micron will manufacture the NAND on 50-nanometer (nm) and 34-nm process technology.

"Infineon envisions a new role of future SIM cards that will be capable of audio and video mass content storage and even Flash card replacement. Infineon is committed to enabling the entire HD-SIM market with a comprehensive HD-SIM product portfolio from single-digit megabytes to 2 gigabytes that offers the right level of performance and security," said Dr. Helmut Gassel, vice president and general manager of the Chip Card and Security division at Infineon Technologies. "Our customers - chip card manufacturers and mobile network operators alike - benefit from our intelligent HD-SIM microcontroller family concept enabling comfortable migration between NOR- and NAND-based technologies, limited R&D cost and minimized qualification effort for the HD-SIM platform. And that results in their high flexibility in the emerging HD-SIM market allowing fast reaction in multiple use cases."

Prototypes are expected to be available in the autumn of 2009 and will be sold in die form or in a chip card IC package.

Posted to the site on 3rd November 2008