DoCoMo, Renesas, Fujitsu, and Sharp to Jointly Develop HSUPA Mobile Phone

A group of Japanese firms, including mobile operator, DoCoMo have announced plans to jointly develop a SH-Mobile G4 single-chip LSI device, and a mobile phone platform incorporating it, to support the HSPA/W-CDMA and GSM standards.

The new SH-Mobile G4 will be fabricated with 45-nm process technology to enable highly integrated functions and extra-fast processing. It will provide enhanced functionality and improved performance for applications handling HD video and 3-D graphics.

In 2004 NTT DoCoMo and Renesas began joint development work on the SH-Mobile G series of single-chip LSI devices, which integrate a baseband processor that supports dual-mode communication and an application processor. The SH-Mobile G4 will be the fourth product to emerge from this collaboration.

The joint development work by NTT DoCoMo and Renesas on single-chip LSI devices has since progressed to include handset manufacturers such as Fujitsu and Sharp as partners in the development of mobile phone platforms. Each platform has a SH-Mobile G series product as the core component and includes a basic software suite (OS, middleware, and drivers) and a reference chipset in a single package.

Renesas plans to provide the platform to the worldwide mobile phone market, in addition to customers in Japan.

Development of the platform is targeted for completion by the fourth quarter of fiscal 2009 (January-March 2010).

Posted to the site on 16th October 2008