Infineon Introduces World's Smallest 3G Handset Platforms
Published on: 29th May 2008
Note -- this news article is more than a year old.
Infineon Technologies has announced the availability of its new generation 3G platform family, which reduces the number of devices in the chipset from three to two and the component count of a typical platform by 50 per cent. The solutions are based on new members of the X GOLD 61x series and Infineon's 3G Radio Frequency (RF) transceiver device, the SMARTi UE.
The new 3G-solutions offer what the company says is the industry's smallest PCB (printed circuit board) footprint with a space reduction of up to 40 per cent. Furthermore the standby power is reduced by up to 30 per cent compared to existing HSDPA platform solutions.
"Our new platforms enable our customers to fully reuse their hardware and software developments and launch multiple phones covering all feature phone market segments with lower cost and faster time-to-market," said Prof. Dr. Hermann Eul, Executive Vice President of the Infineon Management Board and President of the Communication Solutions Business Group.
The platform XMM 6180 with the X-GOLD 618 baseband offers HSDPA/HSUPA capabilities of 7.2Mbps/2.9Mbps, an integrated high-end video accelerator for recording and playback of VGA video content and the ability to connect to cameras with up to 5 MPixels.
The 3G feature phone platform XMM 6170 with the X-GOLD 617 baseband supports HSDPA 3.6Mbps, recording and playback functionality of QVGA video content and the ability to connect to cameras with 2 MPixels.
The modem platform solution XMM 6160 with the X-GOLD 616 baseband offers HSDPA/HSUPA capabilities of 7.2Mbps/5.8 Mbps and includes hardware and software interfaces to an application processor or a PC as wireless modem.
Verified samples and evaluation boards are available by end of June. Volume production starts in the second half of 2009.