Increasing Use of High-density Interconnect Boards in Smartphones

As more smartphones are coming on to the market, the designs are increasingly switching to more layers within their high-density interconnect (HDI) boards. The Taiwan based DigiTimes publication reports that HDI boards which support a 1+n+1 or 2+n+2 stack-in structure no longer fulfill today's handset requirements. From 2007, more high-end handsets are requiring 3+n+3 stack-in structure HDI boards.

Indeed two high end handsets have reportedly switched to a 4+n+4 stack-in structure.

High density interconnects (HDI) are substrates or boards with a greater wiring density per unit area than conventional substrates or boards. Finer lines and spaces (<75 micron) and smaller vias (15 micron) and capture pads (400 micron) than employed in conventional technology are other key attributes of HDI, used to reduce size and weight and to enhance electrical performance. The nature of HDI also allows innovation in three-dimensional packaging, since it permits vias in the x direction, via conductivity in the y direction and vias and dielectrics simultaneously in the z direction (x+y).

Unitech Printed Circuit Board General Manager, Cheng-Hung Hsu said "While more HDI boards are now in 3+n+3 structure, industry players are aware of the emergence of four-layer HDI boards. They noted that two handset vendors, from Canada and Japan, have started to adopt 4+n+4 HDI boards, with shipments slated to begin in September."

He noted though that as other suppliers are being conservative over demand - there could be supply shortages in the future. Whilst not directly related, Sony Ericsson spooked the market last week when it warned of supply shortages in unspecified areas.

On the web: DigiTimes

Posted to the site on 24th March 2008

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