Commit Releases Chipset Solution Supporting TD-HSDPA/GSM/GPRS/EDGE

China based Commit, a TD-SCDMA chipset solution vendor, has announced the release of its MARS-II chipset solution and reference design supporting TD-HSDPA/GSM/GPRS/EDGE. The company says its solution can fully meet operators' requirements for commercial TD-SCDMA deployment in terms of seamless handover between TD-SCDMA and 2.5G communications, HSDPA, high-end 3G applications and low power consumption.

The baseband chip of MARS-II is produced in 90nm semiconductor process. Meanwhile, the flexible, scalable and open platform allows customers to develop differentiated products. Based on MARS-II chipset, Commit also developed evaluation platform, data card turnkey solution and completed terminal solution. These products can dramatically shorten the time-to-market for customers' products.

Mr. Jian Hu, TD-SCDMA Product line Vice-General Manager of ZTE Corporation, said, "Commit HSDPA solution has been tested with ZTE network system both indoors and in the field since the beginning of this year. Commit solution can offer customers stable HSDPA data service. The most outstanding advantage of HSDPA is efficiently increasing the system capacity of data transmission and dramatically enhancing the competitiveness of TD- SCDMA."

As of now, engineering samples and reference designs are ready for customers to develop and test their products.

COMMIT, established in February 2002, is a group which consists of 17 enterprises, including China Putian Corp., China Academy of Telecommunications Technology (CATT), Texas Instruments (China), Nokia China, LG Electronics, and Hyper Market International.

Posted to the site on 17th October 2007