Wafer-Thin Camera Unit for Camera Phones
A new "wafer-thin" camera for mobile phones has been shown off by Tessera Technologies. Tessera's OptiML WLC technology makes it possible for cameras to be manufactured at the wafer level, drastically reducing the size and total bill of material cost of camera modules.
Using OptiML WLC technology, thousands of lenses are manufactured simultaneously on a wafer, and then bonded at the wafer level to create the optical element of the camera. The result is simplified assembly and up to 30% cost savings for the optical component of the camera module. OptiML WLC technology also reduces the size of the camera to a minimum, delivering up to 50% size reductions over conventional camera modules in camera phones today.
Tessera's recently acquired Eyesquad technology can be easily integrated into the OptiML WLC solution, providing advanced auto-focus and digital optical zoom without the use of moving parts.
According to Bruce McWilliams, Tessera's Chairman, President and CEO, "We believe utilizing a wafer-level camera manufacturing technology is the most viable path to overcoming the challenges facing the industry today. With our acquisitions of Shellcase, Digital Optics and Eyesquad, we have assembled what we believe to be the strongest portfolio of camera optic technologies in the marketplace."
Posted to the site on 15th June 2007