First 3G HSUPA Demos
Option says that they have successfully completed the industry's first demonstration of live HSUPA (High Speed Uplink Packet Access) data card calls reaching a wireless uplink transmission rate of 1.3 Mbps and a wireless downlink of 2.7 Mbps at application level. The test calls were carried out at Nortel's research campus in Chateaufort, France. Commercial availability of "HSUPA-Ready" and full HSUPA products from Option are planned for the first half of 2007.
HSUPA, the next step after HSDPA, enhances the data speed in the uplink up to a theoretical maximum of 5.7 Mbps, from the 384 kbps currently available with HSDPA. Higher performance is achieved through more efficient uplink scheduling in the base station and faster retransmission control. Whereas HSDPA (High-Speed Downlink Packet Access) enables users to receive large data files across the "downlink", HSUPA increases the speed at which users can send large data files across the "uplink".
A laptop fitted with an Option HSUPA data card (category 3 in uplink, cat 6 in downlink) based on Qualcomm Mobile Station Modem, MSM7200 chipset and commercial HSDPA/HSUPA network equipment from Nortel were used to achieve the new record data speeds.
The companies completed an initial series of tests showcasing the HSUPA advantages for a large number of applications such as: uploading a 15 MB file onto a server, sending and receiving e-mails with large attachments, demonstrating the simultaneous HSD (High Speed Downlink) and HSUPA capabilities and video conference over IP. In addition, the HSUPA and HSDPA calls were also conducted in a car while driving at 50 km/h.
Jan Callewaert, CEO of Option: "Another world first for Option, this successful HSUPA test confirms our product roadmap is on schedule and underscores our commitment to bringing the most advanced wireless broadband solutions to market. The strong relationships that we enjoy with leading chipset suppliers and infrastructure providers - Qualcomm and Nortel, - are important elements in our continuing technological and product leadership."
Posted to the site on 12th October 2006