Multi-Chip NAND Flash Solution for Latest Mobile Phones

STMicroelectronics has announced a new MCP (Multi-Chip Package) memory portfolio designed to meet the needs of multimedia applications in 3G and CDMA mobile phones, and in other portable devices, where memory requirements are high and space and power are limited. The series offers memory densities up to 1-Gbit of NAND Flash with up to 512-Mbit of LPSDRAM (Low-Power Synchronous Dynamic RAM) in a single package, and has been developed in close cooperation with chipset enablers and operating system (OS) vendors to ensure that it matches the requirements of phone manufacturers and is compliant with the major mobile platforms.

Multi-chip packages mount two (or more) chips in a single package to minimize the space required in critical applications, while increasing the memory density and offering the necessary different memory types. ST is a leader in MCP design and manufacturing technology, and has designed the new series to offer the widest range of NAND Flash and LPSDRAM combinations in one package, providing fast time-to-market and high design flexibility, and satisfying customers' differing handset memory requirements.

The new MCPs can be configured in many different ways to match a variety of specific applications: bus width, memory density, clock frequency and data rate can be configured to meet specific requirements. The NAND Flash and LPSDRAM components have separate power supplies and ground lines, as well as separate control, address and I/O signals, to allow simultaneous access to both chips."

Posted to the site on 24th February 2006